Welcome to the EPEPS 2024 website!
EPEPS is the premier international conference on advanced and emerging issues in the electrical modeling, analysis, and design of electronic interconnections, packages, and systems. Over four days, the conference will feature the latest advancements in modeling, design, and measurement techniques for:
- signal integrity & power integrity
- advanced packaging and heterogeneous integration
- performance optimization
of systems for high-speed electronics, RF and wireless communication, and quantum computing.
We look forward to seeing you in Toronto!
Piero Triverio & Wendem Beyene
Highlights & reasons to attend
- top-notch 4-day program, with keynotes, presentations, posters and demo sessions focused on the latest advancements from academia and industry
- four prestigious awards for the best contributions
- a full day of tutorials on the latest advancements in package/PCB design, signal and power integrity modeling, high-speed SerDes simulation, high precision measurement techniques and novel interconnect designs
- IEEE education credits: attend EPEPS and earn professional development hours (PDHs) and continuing education units (CEUs)
- industry exhibition and demos, to learn about the latest products and solutions available on the market
- sponsorship & exhibitor opportunities to promote your company’s latest developments and increase your brand visibility to a specialized audience from the top companies and universities in the field
- Toronto is the fastest growing tech hub in North America, home of a talent pool of 400,000+ post-secondary students, and one of the most vibrant and multicultural cities in the world
- visit Canada in its most spectacular season, with Fall colors in full swing and the Niagara Falls only 1.5 hours away!